AEM Inc.

AEM, a world leading SMD fuses producer, introduces its new F1206HC series fuses with compact 1206size at 35VDC rated voltage, which is the smallest device at this voltage rating on the market. The current rating of F1206HC fuse is from 10A to 40A.

Typical applications include:

• Multi-cell lithium battery pack
• Brush-less DC motor driver circuits
• Switches, Routers, servers and storage systems, GPU board, etc.

“The customers of the lithium battery powered devices like handheld power tools and handheld/robotic vacuum are asking for higher power and longer run-time per charge, at the same time, lighter and smaller size.” says Dr. Liwu Wang, the business development director of AEM, “the new F1206HC series comes with 35VDC which can be used in the devices with up to 8-cell battery packs. It can help design engineer to meet the customer demands of higher power/voltage rating, small compact size and light weight.”

The key features of the F1206HC series are

• Current rating 10 to 40A at 35VDC rated voltage
• Compact 1206 size with footprint of 3.2mm x 1.6mm
• Low DC resistance reduces heat dissipation which is critical in high power applications

F1206HC series is available in tape and reel format with 3000 pcs per reel.

AEM Inc.'s Hi-Rel Ferrite Chips are classified EAR99. They are intended for high reliability applications where replacement is not an option, applications can include General noise, EMI and RFI suppression

Product Documentation

AEM is the sole QPL listed manufacturer of solid body, current limiting fuses, which are produced using a thick film technique for the aerospace industry. AEM's fuses have been selected by most major space programs and have been in orbit for the past 30-plus years with zero reported failures. Their applications include military and commercial satellites and manned space vehicles.

The AEM exclusive Sn/Pb conversion process has been qualified by major aerospace OEMs. The Tin Whisker Mitigation (TWM) process involves adding lead (Pb) to chip size components with pure tin (Sn) terminals. Our Sn-Pb conversion process involves both Sn-Pb plating and subsequent fusion processing to ensure that the resultant component terminations are a homogenous mixture of Sn-Pb.

Issues Facing Hi-Rel Product Manufacturers:

• Components with solder terminals comprised of >3% lead are not prone to tin whisker problems.
• Whiskers tend to grow unpredictably on 100% tin surfaces.
• There is no accepted accelerated method to test for the propensity of tin whisker growth.
• Components with 100% tin external radial-leaded components can be tin / lead hot solder dipped, although this is not always 100% effective.
• 100% tin terminated chip size style components should not be tin / lead hot solder dipped due to thermal shock concerns.

Exclusive AEM Sn/Pb Conversion Process Has Been Qualified by Major Aerospace OEMs:

• The AEM tin / lead conversion process is effective for most chip size passive components including capacitors, inductors, resistors, ferrite chip beads, fuses, resistor arrays, capacitor arrays, bead arrays, and many molded body passive and active surface mount component types.
• Tin / lead processed components are subjected to 100% visual and mechanical inspections per applicable EIA guidelines (including sample solderability, leach resistance, terminal strength and DPA screening).
• Optional component up-screening and QCI also performed by AEM's MIL-STD-202 lab.
• Tin / lead converted and up-screened components will be warranted as AEM products.
• AEM's tin / lead conversion process is applicable to most multi-layer chip style components. Other components may be processed subject to an AEM pre-evaluation and component construction analysis (generally performed by AEM at no cost to customer).

Product Documentation